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*Behlke高壓開關(guān) HTS 640-100-SCR

Behlke產(chǎn)品分類

高壓電子開關(guān)、高壓發(fā)生器

Behlke主要應(yīng)用：

需要產(chǎn)生高電壓快速脈沖的場合,例如：快速脈沖群發(fā)生器，泡克耳斯盒驅(qū)動器，雷達(dá)調(diào)節(jié)器等

Behlke主要系列：

HTS全系列

德Behlke HTS 60-100-SCR

德Behlke HTS 60-200-SCR

德Behlke HTS 120-100-SCR

德Behlke HTS 40-1000-SCR

德Behlke HTS 80-200-SCR

德Behlke HTS 80-500-SCR

德Behlke HTS 160-200-SCR

德Behlke HTS 150-200-SCR

德Behlke HTS 300-100-SCR

德Behlke HTS 60-1000-SCR

Switch Model [sorted by voltage]	DeSCRJPTion / Comment ● Preferred stock type ○ Lead time > 6 weeks X Not for new development		Max. Voltage [kV]	Peak Current [A]	Peak Power [MW]	On- Time [μs]	Housing Dimensions [mm³]	Drawing (PDF)
HTS 40-1000-SCR	●	Sync. I/O for parallel connection.	4	10000	40	35…∞	89 x 64 x 31	request
HTS 60-1000-SCR	●	Sync. I/O for parallel connection.	6	10000	60	35…∞	122 x 64 x 31	request
HTS 60-100-SCR	●	Tubular housing with HV pigtails. Coo options not available.	6.4	1000	6.4	35…∞	135 x 20 x 20	request
HTS 60-200-SCR	●	LED indicators. Very compact design - CF options partly not applicable!	6.4	2000	12.8	35…∞	80 x 38 x 25	PDF
HTS 80-200-SCR	●	Sync. I/O for parallel connection.	8	2000	16	35…∞	89 x 64 x 31	request
HTS 80-500-SCR	●	Sync. I/O for parallel connection.	8	5000	40	35…∞	89 x 64 x 31	PDF
HTS 80-1000-SCR	●	Sync. I/O for parallel connection.	8	10000	80	35…∞	153 x 64 x 31	PDF
HTS 100-1600-SCR	●	LED indicators & Sync. I/O for parallel connection	10	16000	160	35…∞	179 x 103 x 35	request
HTS 120-200-SCR	●	Sync. I/O for parallel connection.	12	2000	24	35…∞	122 x 64 x 31	request
HTS 120-500-SCR	●	Sync. I/O for parallel connection.	12	5000	60	35…∞	122 x 64 x 31	PDF
HTS 120-1600-SCR	●	LED indicators & Sync. I/O for parallel connection	12	16000	192	35…∞	204 x 103 x 35	request
HTS 120-100-SCR	●	LED indicators. Very compact design - CF options partly not applicable!	12.8	1000	12.8	35…∞	80 x 38 x 25	PDF
HTS 150-200-SCR	●	LED indicators. Very compact design - CF options partly not applicable!	15	2000	30	35…∞	103 x 70 x 35	request
HTS 160-200-SCR	●	Sync. I/O for parallel connection. HV connection by pigtails only.	16	2000	32	35…∞	89 x 64 x 31	request
HTS 160-500-SCR	●	Sync. I/O for parallel connection.	16	5000	80	35…∞	153 x 64 x 31	PDF
HTS 160-200-SCR	●	Sync. I/O for parallel connection.	16	2000	32	35…∞	153 x 64 x 31	request
HTS 160-1600-SCR	●	LED indicators & Sync. I/O for parallel connection	16	16000	256	35…∞	253 x 103 x 35	request
HTS 200-800-SCR	●	LED indicators & Sync. I/O for parallel connection	20	8000	160	35…∞	179 x 103 x 35	request
HTS 220-800-SCR	●	LED indicators & Sync. I/O for parallel connection	22	8000	176	35…∞	179 x 103 x 35	request
HTS 220-1000-SCR	●	LED indicators & Sync. I/O for parallel connection	22	10000	220	35…∞	252 x 150 x 40	request
HTS 220-1200-SCR	●	LED's, Sync. I/O, housing style as before, but with separate control unit	22	12000	264	35…∞	160 x 150 x 30	PDF
HTS 240-100-SCR	●	LED indicators. Very compact design - CF options partly not applicable!	24	1000	24	35…∞	103 x 70 x 35	PDF
HTS 240-800-SCR	●	LED indicators & Sync. I/O for parallel connection	24	8000	192	35…∞	204 x 103 x 35	request
HTS 240-1000-SCR	●	LED indicators & Sync. I/O for parallel connection	24	10000	240	35…∞	252 x 150 x 40	request
HTS 240-1200-SCR	●	LED's, Sync. I/O, housing style as before, but with separate control unit	24	12000	288	35…∞	160 x 150 x 30	request
HTS 300-100-SCR	●	LED indicators. Very compact design - CF options partly not applicable!	30	1000	30	35…∞	103 x 70 x 35	request
HTS 320-200-SCR	●	Sync. I/O for parallel connection. HV connection by pigtails only.	32	2000	64	35…∞	153 x 64 x 31	request
HTS 320-800-SCR	●	LED indicators & Sync. I/O for parallel connection	32	8000	256	35…∞	253 x 103 x 35	request
HTS 320-200-SCR	●	LED indicators. Very compact design - CF options partly not applicable!	32	2000	64	35…∞	206 x 70 x 35	request
HTS 350-800-SCR	●	With LED indicators, enlarged housing, many options simultaneously integratable	35	8000	280	35…∞	372 x 200 x 43	request
HTS 400-200-SCR	●	LED indicators. Very compact design - CF options partly not applicable!	40	2000	80	35…∞	312 x 120 x 38	request
HTS 440-1200-SCR	●	Sync. I/O for parallel connection, separate control unit	44	12000	528	35…∞	312 x 200 x 45	request
HTS 500-1200-SCR	●	Sync. I/O for parallel connection, separate control unit	50	12000	600	35…∞	372 x 200 x 50	request
HTS 600-200-SCR	●	With LED indicators. HV connection by pigtails only.	60	2000	120	35…∞	372 x 120 x 50	request
HTS 640-100-SCR	●	LED indicators. Very compact design - CF options partly not applicable!	64	1000	64	35…∞	206 x 70 x 35	request
HTS 800-100-SCR	●	LED indicators. Very compact design - CF options partly not applicable!	80	1000	80	35…∞	312 x 120 x 38	PDF
HTS 1200-100-SCR	●	With LED indicators. HV connection by pigtails only.	120	1000	120	35…∞	372 x 120 x 50	request
HTS 1200-2400-SCR	●	Flange or tubular housing. External control unit.	120	24000	2880	35…∞	672 x 400 x 68	request
HTS 1500-1000-SCR	○	Sync. I/O for parallel connection, separate control unit	150	10000	1500	35…∞	on request	request

Options (1)

HFB	High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated.
HFS	High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded.(2)
LP	Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3)
ST	Stage Tapping: Connectors at the individual stages of stack in order to utilie single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo).
ISO-25	25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models.
ISO-40	40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
ISO-80	80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
ISO-120	120 kV Isolation: Isolation Voltage increased to 120 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV.
I-PC	Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors, snubbers, damping resistors, diodes, opto couplers).(2)
I-FWD	Integrated Free-Whee Diode: Built-in parallel diode with short recovery time. In connection with inductive load only.
LS-C	LEMO socket for Control Connection: Input =100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3)
PT-C	Pigtail for Control Connection: Flexible leads (l=75 mm) with AMP-Modu plug. Only for switches with pins, which must be replaced by pigtails in case of any coo option except option ITC.
PIN-C	Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard.
PT-HV	Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits.
ST-HV	Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting.
SEP-C	Separated Control Unit: Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails.
FOI-C	Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2)
FOO-F	Fibre Optics Output / Fault: Additional optical output to read-out the failure condition of the switch by means of a fibre-optical signal (only in combination with option SEP-C) (2)
UL94	Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2)
FH	Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested.
TH	Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. (2)
FC	Flat Case: Height of standard plastic housings reduced to 19 / 25 mm. Not in combination with coo options CF, GCF and DLC.
ITC	Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2)
CF	Copper Coo Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air coo with forced or natural convection as well as for liquid coo with non-conductive coolants.
CF-1	Copper Coo Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid coo (e.g. Galden® or oil).
CF-X2	Copper Coo Fins "XL": Fin area enlarged by factor 2. Recommended for natural air convection. No significant coo power improvement in connection with forced air or liquid coo.
CF-X3	Copper Coo Fins "XXL": Fin area enlarged by factor 3. Recommended for natural air convection. No significant coo power improvement in connection with forced air or liquid coo.
CF-CS	Copper Coo Fins with customied shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1, CF-D and CF-S for increased coo power.
CF-LC	Copper Coo Fins for liquid coo: Double fins, nickel plated copper, height 20 mm. For the immersion in oil tanks etc. Forced convection recommended. Combinable with opt. CF-S.
CF-D	Double Copper Coo Fins: Approx. 100% more coo power, approx. 2mm spacing between fins, forced convection recommended. Combinable with opt. CF-S, CF-X2, CF-X3 and CF-CS.
CF-S	Copper Coo Fins: Semiconductors soldered on fins. Approx. 30% to 100% more coo power (type depending). Combinable with options CF-D, CF-X2, CF-X3 and CF-CS.
CF-GRA	Non-isolated Coo Fins made of graphite: Very light weight compared to copper at similar heat transfer, but reduced heat capacity. 0.5 or 1 mm thickness, height 35 mm.
CF-CER	Isolated Coo Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm.
CCS	Ceramic Coo Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended.
CCF	Ceramic Coo Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation.
C-DR	Coo for Driver: Extra coo for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2)
GCF	Grounded Coo Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coup capacitance. In combination with option SPT-C only.
GCF-X2	Grounded Coo Flange, Max. Continuous Power Dissipation increased by x2: Thermal resistance “Switch to Flange” reduced for twice the power capability. (2)
ILC	Indirect Liquid Coo: Liquid coo for all kind of conductive coolants incl. water. Internal heat exchanger made of ceramics. For medium power dissipation.
DLC	Direct Liquid Coo: Internal coo channels arround the power semiconductors. The most efficient coo for high frequency applications. Non-conductive coolants only.
HI-REL	High Reliability / MIL Versions: Available on request. (2)

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北京志鴻恒拓科技有限公司

北京志鴻恒拓科技有限公司

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