116-04A / B-187極導(dǎo)熱環(huán)氧灌封料
- 公司名稱 世聯(lián)博研(北京)科技有限公司
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- 更新時(shí)間 2019/10/15 9:52:34
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EPOXY POTTING COMPOU極導(dǎo)熱環(huán)氧灌封料雙組分環(huán)氧灌封封裝化合物壽命長耐熱性高
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116-04A / B-187極導(dǎo)熱環(huán)氧灌封料
說明:116-04A是一種氮化物填充的雙組分環(huán)氧灌封和封裝化合物。產(chǎn)品是
設(shè)計(jì)用于在固化過程中迅速釋放滯留空氣,從而形成光滑、無針孔的表面。使用B-187時(shí)
希望使用壽命長,耐熱性高。116-04A是F940A更導(dǎo)熱的版本。
A部分B部分-187混合物
外觀:灰琥珀灰
粘度(cps):3600 500 3100
配合比(按重量計(jì)):100 3----
適用期:---->4小時(shí)
混合說明:在加入固化劑之前,在原容器中預(yù)混料A部分。將B部分添加到A部分
攪拌均勻。當(dāng)需要高溫性能時(shí),與零件B-187一起使用。注:不是
B-187的結(jié)晶不常見。在水浴中加熱至40-45°C,使材料返回
原始粘度。催化劑的結(jié)晶不會(huì)以任何方式影響產(chǎn)品的性能。到
防止再結(jié)晶,將B-187儲(chǔ)存在35-45°C之間。
固化說明:
處理性能:80°C時(shí)30分鐘
*固化:80°C下1小時(shí)或
100°C時(shí)30分鐘
典型固化特性:
比重1.63
硬度(肖氏硬度d)>85
科夫。熱膨脹(in/in/℃x 10-6
)22個(gè)
熱量。條件。(帶MK)2.63
固化收縮率(%)0.189
熱變形溫度(攝氏度)115
抗拉強(qiáng)度(psi)9600
吸水率(%)<0.22
介電強(qiáng)度(伏特/密耳)475
體積電阻率(Ω-cm)1 x 1015
功率因數(shù)(60赫茲)0.028
介電常數(shù)(60赫茲)4.3
儲(chǔ)存:保質(zhì)期:在20-25°C的原始密封容器中保存12個(gè)月。
116-04A / B-187極導(dǎo)熱環(huán)氧灌封料
116-04A / B-187
EXTREMELY THERMALLY CONDUCTIVE, EPOXY POTTING COMPOUND
DESCRIPTION: 116-04A is a nitride filled, two component, epoxy potting and encapsulating compound. Product is
designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. Use B-187 when
long pot life and higher heat resistance is desired. 116-04A is a more thermally conductive version of F940A.
Part A Part B-187 Mixture
Appearance: Grey Amber Grey
Viscosity (cps): 3600 500 3100
Mix Ratio (By Weight): 100 3 ----
Pot Life: ---- ---- > 4 Hrs
MIXING INSTRUCTIONS: Premix Part A in original container prior to adding curing agent. Add Part B to Part A
and mix until uniform. Use with Part B-187 when high temperature performance is desired. NOTE: It is not
unusual for crystallization of the B-187 to occur. Warm to 40-45°C in a water bath to return the material to it's
original viscosity. The crystallization of the catalyst does not affect the performance of the product in any way. To
prevent re-crystallization, store the B-187 at temperatures between 35-45°C.
CURING INSTRUCTIONS:
Handling Properties: 30 min @ 80°C
Full Cure: 1 hr @ 80°C or
30 min @ 100°C
TYPICAL CURED PROPERTIES:
Specific Gravity 1.63
Hardness (Shore D) > 85
Coef. of Thermal Exp. (in/in/°C x 10-6
) 22
Therm. Cond. (W/mK) 2.63
Cure Shrinkage (%) 0.189
Heat Distortion Temp. (°C) 115
Tensile Strength (psi) 9600
Water Absorption (%) < 0.22
Dielectric Strength (volts/mil) 475
Volume Resistivity (Ω-cm) 1 x 1015
Power Factor (60 HZ) 0.028
Dielectric Constant (60 HZ) 4.3
STORAGE: Shelf Life: 12 months at 20-25°C in original sealed containers.